Achieving Significant Thermal Conductivity Enhancement via an Ice-Templated and Sintered BN-SiC Skeleton

Author:

Yao Yimin12ORCID,Ye Zhenqiang1,Huang Feiyang1,Zeng Xiaoliang1ORCID,Zhang Tao1,Shang Tianyu13,Han Meng1,Zhang Weilin1,Ren Linlin1,Sun Rong1ORCID,Xu Jian-Bin2ORCID,Wong Ching-Ping4ORCID

Affiliation:

1. Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, Shenzhen 518055, China

2. Department of Electronics Engineering, The Chinese University of Hong Kong, Shatin, N.T., Hong Kong 999077, China

3. Department of Nano Science and Technology Institute, University of Science and Technology of China, Suzhou 215123, China

4. School of Materials Science and Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, United States

Funder

Ministry of Science and Technology of the People's Republic of China

China Postdoctoral Science Foundation

Frontier Sciences Key Research Program of the Chinese Academy of Sciences

Shenzhen international cooperation project

SIAT CAS-CUHK Joint Laboratory of Materials and Devices for High Density Electronic Packaging

Shenzhen Basic Research Plan

Guangdong Provincial Key Laboratory

Publisher

American Chemical Society (ACS)

Subject

General Materials Science

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