Environmental Impact Assessment of Chemical Mechanical Planarization Consumables: Challenges, Future Needs, and Perspectives-Reference-Cited by-同舟云学术

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Environmental Impact Assessment of Chemical Mechanical Planarization Consumables: Challenges, Future Needs, and Perspectives

Published:2024-07-26 Issue:32 Volume:12 Page:11841-11855
ISSN:2168-0485
Container-title:ACS Sustainable Chemistry & Engineering
language:en
Short-container-title:ACS Sustainable Chem. Eng.

Author:

Venkataswamy Ravitej¹,Trimble Lyle¹,McDonald Andrew²,Nevers Douglas³,Bengochea Leticia Vazquez²,Carswell Andrew²,Rossner Alan⁴,Seo Jihoon¹^ORCID

Affiliation:

1. Department of Chemical & Biomolecular Engineering, Clarkson University, Potsdam, New York 13699, United States

2. DRAM CMP, Micron Technology Inc, Boise, Idaho 83707, United States

3. NAND CMP, Micron Technology Inc, Boise, Idaho 83707, United States

4. Institute for a Sustainable Environment, Clarkson University, Potsdam, New York 13699, United States

Funder

Micron Technology

Publisher

American Chemical Society (ACS)

Link

https://pubs.acs.org/doi/pdf/10.1021/acssuschemeng.4c03195

Reference113 articles.

1. A survey on machine and deep learning in semiconductor industry: methods, opportunities, and challenges

2. Borderless Collaboration in Materials Chemistry for an Industrial Ecosystem in the Semiconductor Industry

3. Assessing the Environmental Impact of Atomic Layer Deposition (ALD) Processes and Pathways to Lower It

4. Internet of Things Market Analysis Forecasts, 2020–2030

5. Opportunities and challenges of artificial intelligence in banking and financial services

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