Asynchronously Pulsed Plasma for High Aspect Ratio Nanoscale Si Trench Etch Process
Author:
Affiliation:
1. School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon 16419, Korea
2. SKKU Advanced Institute of Nano Technology (SAINT), Sungkyunkwan University, Suwon 16419, Korea
Funder
Samsung
Publisher
American Chemical Society (ACS)
Subject
General Materials Science
Link
https://pubs.acs.org/doi/pdf/10.1021/acsanm.3c00807
Reference31 articles.
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