Nanoscale Heat Transport of Vertically Aligned Carbon Nanotube Bundles for Thermal Management Applications-Reference-Cited by-同舟云学术

Nanoscale Heat Transport of Vertically Aligned Carbon Nanotube Bundles for Thermal Management Applications

Published:2024-08-13 Issue:34 Volume:16 Page:45671-45677
ISSN:1944-8244
Container-title:ACS Applied Materials & Interfaces
language:en
Short-container-title:ACS Appl. Mater. Interfaces

Author:

Spièce Jean¹²^ORCID,Lulla Kunal²³,de Crombrugghe de Picquendaele Pauline¹,Divay Laurent⁴,Bezencenet Odile⁴,Hackens Benoit¹^ORCID,Gehring Pascal¹^ORCID,Robson Alex J.²,Evangeli Charalambos²⁵^ORCID,Kolosov Oleg V.²^ORCID

Affiliation:

1. IMCN/NAPS, UCLouvain, B-1348 Louvain-la-Neuve, Belgium

2. Physics Department, Lancaster University, LA1 4YB Lancaster, U.K.

3. National Graphene Institute, The University of Manchester, M13 9PL Manchester, U.K.

4. Thales Research and Technology, 1, Avenue Augustin Fresnel, 91767 Palaiseau, France

5. Department of Materials, University of Oxford, Parks Road, OX1 3PH Oxford, U.K.

Funder

Engineering and Physical Sciences Research Council

UK Research and Innovation

European Research Council

FP7 Nanosciences, Nanotechnologies, Materials and new Production Technologies

F?d?ration Wallonie-Bruxelles

H2020 Future and Emerging Technologies

Fonds Wetenschappelijk Onderzoek

Fonds De La Recherche Scientifique - FNRS

Publisher

American Chemical Society (ACS)

Link

https://pubs.acs.org/doi/pdf/10.1021/acsami.4c07913

Reference52 articles.

1. Present and future thermal interface materials for electronic devices

2. Thermal Interface Materials: Historical Perspective, Status, and Future Directions

3. Thermal Interface Materials Based on Vertically Aligned Carbon Nanotube Arrays: A Review

4. Enhancement of thermal interface materials with carbon nanotube arrays

5. Thermal resistance of thermal conductive adhesive anchored carbon nanotubes interface material