1. School of Electronics and Information Engineering, Tianjin Key Laboratory of Electronic Materials and Devices, Hebei University of Technology, 5340 Xiping Road, Beichen District, Tianjin 300401, China
2. Hebei Collaborative Innovation Center of Microelectronic Materials and Technology on Ultra Precision Processing, Hebei Engineering Research Center of Microelectronic Materials and Devices (ERC), Tianjin 300130, China
3. Innovation and Research Institute of Hebei University of Technology in Shijiazhuang, Shijiazhuang 050299, China
4. Department of Chemical and Biomolecular Engineering, The Ohio State University, Columbus, Ohio 43210, United States