Exploring Disturb Characteristics in 2D and 3D Ferroelectric NAND Memory Arrays for Next-Generation Memory Technology

Author:

Kim Ik-Jyae1ORCID,Choi Jiwoung1ORCID,Lee Jang-Sik1ORCID

Affiliation:

1. Department of Materials Science and Engineering, Pohang University of Science and Technology (POSTECH), Pohang 37673, Korea

Funder

Samsung

National Research Foundation of Korea

Publisher

American Chemical Society (ACS)

Reference39 articles.

1. Breyer, E. T.; Mulaosmanovic, H.; Mikolajick, T.; Slesazeck, S. In Reconfigurable NAND/NOR logic gates in 28 nm HKMG and 22 nm FD-SOI FeFET technology, 2017 IEEE International Electron Devices Meeting (IEDM), 2017; pp 28.5.1–28.5.4.

2. 3-D NAND Technology Achievements and Future Scaling Perspectives

3. Whang, S.; Lee, K.; Shin, D.; Kim, B.; Kim, M.; Bin, J.; Han, J.; Kim, S.; Lee, B.; Jung, Y.; Cho, S.; Shin, C.; Yoo, H.; Choi, S.; Hong, K. In Novel 3-dimensional Dual Control-gate with Surrounding Floating-gate (DC-SF) NAND flash cell for 1Tb file storage application, 2010 International Electron Devices Meeting, 2010; pp 29.7.1–29.7.4.

4. A 512-Gb 3-b/Cell 64-Stacked WL 3-D-NAND Flash Memory

5. Lue, H.T.; Lai, S.C.; H, T.H.; Hsiao, Y.H.; Du, P.Y.; Wang, S.Y.; Hsieh, K.Y.; Liu, R.; Lu, C.Y. A critical review of charge-trapping NAND flash devices, 2008 9th International Conference on Solid-State and Integrated-Circuit Technology, 2008; pp 807–810.

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