Control of Wafer Temperature Uniformity in Rapid Thermal Processing Using an Optimal Iterative Learning Control Technique
Author:
Affiliation:
1. Department of Chemical Engineering, Sogang University, Shinsoo-1, Mapogu, Seoul 121-742, Korea
2. School of Chemical Engineering, Georgia Institute of Technology, 778 Atlantic Drive, Atlanta, Georgia 30332-0100
Publisher
American Chemical Society (ACS)
Subject
Industrial and Manufacturing Engineering,General Chemical Engineering,General Chemistry
Link
https://pubs.acs.org/doi/pdf/10.1021/ie0005553
Reference22 articles.
1. Modeling and control of microelectronics materials processing
2. Temperature uniformity in RTP furnaces
3. A model for rapid thermal processing: achieving uniformity through lamp control
4. Temperature control in a rapid thermal processor
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