Three-Dimensional Graphene Structure for Healable Flexible Electronics Based on Diels

Three-Dimensional Graphene Structure for Healable Flexible Electronics Based on Diels–Alder Chemistry

Published:2018-02-13 Issue:11 Volume:10 Page:9727-9735
ISSN:1944-8244
Container-title:ACS Applied Materials & Interfaces
language:en
Short-container-title:ACS Appl. Mater. Interfaces

Author:

Li Jinhui¹²^ORCID,Liu Qiang¹,Ho Derek²,Zhao Songfang³^ORCID,Wu Shuwen¹,Ling Lei¹,Han Fei¹,Wu Xinxiu¹,Zhang Guoping¹^ORCID,Sun Rong¹^ORCID,Wong Ching-Ping⁴^ORCID

Affiliation:

1. Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, Shenzhen 518055, China

2. Department of Materials Science and Engineering, City University of Hong Kong, 83 Tat Chee Avenue, Kowloon Hong Kong 999077, China

3. School of Material Science and Engineering, University of Jinan, Jinan 250022, China

4. Department of Electronic Engineering, The Chinese University of Hong Kong, Shatin, N.T., Hong Kong 999077, China

Funder

Research Grants Council, University Grants Committee

Government of Guangdong Province

National Natural Science Foundation of China

Natural Science Foundation of Guangdong Province

Shenzhen Institutes of Advanced Technology, Chinese Academy Sciences

Key Laboratory of Guangdong Province

Shenzhen Municipality

Shenzhen Science, Technology and Innovation Commission

Publisher

American Chemical Society (ACS)

Subject

General Materials Science

Link

https://pubs.acs.org/doi/pdf/10.1021/acsami.7b19649

Reference45 articles.

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4. Super-elastic and fatigue resistant carbon material with lamellar multi-arch microstructure

5. Three-dimensionally bonded spongy graphene material with super compressive elasticity and near-zero Poisson’s ratio

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