Vapor-Phase Cleaning and Corrosion Inhibition of Copper Films by Ethanol and Heterocyclic Amines
Author:
Affiliation:
1. Department of Materials Science & Engineering, The University of Texas at Dallas, Richardson, Texas 75080, United States
2. Versum Materials, Inc., 8555 South River Parkway, Tempe, Arizona 85284, United States
Funder
Versum Materials
Publisher
American Chemical Society (ACS)
Subject
General Materials Science
Link
https://pubs.acs.org/doi/pdf/10.1021/acsami.8b13438
Reference73 articles.
1. Mueller, S.; Waechtler, T.; Hofmann, L.; Tuchscherer, A.; Mothes, R.; Gordan, O.; Lehmann, D.; Haidu, F.; Ogiewa, M.; Gerlich, L.; Ding, S. F.; Schulz, S. E.; Gessner, T.; Lang, H.; Zahn, D. R. T.; Qu, X. P. Thermal ALD of Cu Via Reduction of CuxO Films for the Advanced Metallization in Spintronic and ULSI Interconnect Systems. In Semiconductor Conference Dresden, Sept 27–28, 2011; pp 1–4.
2. In-situspectroscopic ellipsometry study of copper selective-area atomic layer deposition on palladium
3. Atomic Layer Deposition of Copper Oxide using Copper(II) Acetylacetonate and Ozone
4. Characteristics of copper films produced via atomic layer deposition
5. Low temperature hydrogen plasma-assisted atomic layer deposition of copper studied using in situ infrared reflection absorption spectroscopy
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