Covalent Grafting of Dielectric Films on Cu(111) Surface via Electrochemical Reduction of Aryl Diazonium Salts-Reference-Cited by-同舟云学术

Covalent Grafting of Dielectric Films on Cu(111) Surface via Electrochemical Reduction of Aryl Diazonium Salts

Published:2022-11-17 Issue:48 Volume:38 Page:14969-14980
ISSN:0743-7463
Container-title:Langmuir
language:en
Short-container-title:Langmuir

Author:

Cao Liang¹^ORCID,Wu Yunwen¹^ORCID,Hang Tao¹^ORCID,Li Ming¹

Affiliation:

1. State Key Laboratory of Metal Matrix Composites, School of Material Science and Engineering, Shanghai Jiao Tong University, No. 800 Dongchuan Road, Shanghai 200240, China

Funder

National Natural Science Foundation of China

Publisher

American Chemical Society (ACS)

Subject

Electrochemistry,Spectroscopy,Surfaces and Interfaces,Condensed Matter Physics,General Materials Science

Link

https://pubs.acs.org/doi/pdf/10.1021/acs.langmuir.2c02740

Reference79 articles.

1. Attachment of organic layers to conductive or semiconductive surfaces by reduction of diazonium salts

2. Covalent Electron Transfer Chemistry of Graphene with Diazonium Salts

3. Handling diazonium salts in flow for organic and material chemistry

4. Covalent bulk functionalization of graphene

5. Current and future directions in electron transfer chemistry of graphene

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