Molecular Insights into Adhesion at a Buried Silica-Filled Silicone/Polyethylene Terephthalate Interface-Reference-Cited by-同舟云学术

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Molecular Insights into Adhesion at a Buried Silica-Filled Silicone/Polyethylene Terephthalate Interface

Published:2020-12-07 Issue:49 Volume:36 Page:15128-15140
ISSN:0743-7463
Container-title:Langmuir
language:en
Short-container-title:Langmuir

Author:

Lin Ting¹²,Wu Yuchen¹³,Santos Elizabeth⁴,Chen Xiaoyun⁵^ORCID,Ahn Dongchan⁴,Mohler Carol⁵,Chen Zhan¹²^ORCID

Affiliation:

1. Department of Chemistry, University of Michigan, Ann Arbor, Michigan 48109, United States

2. Department of Macromolecular Science and Engineering, University of Michigan, Ann Arbor, Michigan 48109, United States

3. Department of Materials Science and Engineering, University of Michigan, Ann Arbor, Michigan 48109, United States

4. Dow Performance Silicones, Auburn, Michigan 48611, United States

5. Core R&D, Dow Chemical, Midland, Michigan 48674, United States

Funder

Dow Chemical Company

Publisher

American Chemical Society (ACS)

Subject

Electrochemistry,Spectroscopy,Surfaces and Interfaces,Condensed Matter Physics,General Materials Science

Link

https://pubs.acs.org/doi/pdf/10.1021/acs.langmuir.0c02719

Reference81 articles.

1. Research, Z. M. Global industry perspective, comprehensive analysis and forecaset. 2015–2021 .

2. High-Performance Silicone Gel as Integrated-Circuit-Device Chip Protection

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