Large-Area Preparation of a Robust Superamphiphobic Coating for Chemical Mechanical Polishing Application
Author:
Affiliation:
1. LongTour Laboratory, Beijing TSD Semiconductor Co., Ltd., Beijing 101300, People’s Republic of China
2. State Key Laboratory of Tribology, Tsinghua University, Beijing 100084, People’s Republic of China
Funder
Beijing TSD Semiconductor Co., Ltd.
Publisher
American Chemical Society (ACS)
Link
https://pubs.acs.org/doi/pdf/10.1021/acs.langmuir.4c00014
Reference53 articles.
1. Chemical Mechanical Planarization: Slurry Chemistry, Materials, and Mechanisms
2. Approaches to Sustainability in Chemical Mechanical Polishing (CMP): A Review
3. Semi-empirical material removal rate distribution model for SiO2 chemical mechanical polishing (CMP) processes
4. Evaluation of chemical mechanical planarization slurry dispersion using a combined scanning mobility particle sizer-optical particle sizer system
5. Preparation of silane modified SiO2 abrasive particles and their Chemical Mechanical Polishing (CMP) performances
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