Double-Wall Nanotubes and Graphene Nanoplatelets for Hybrid Conductive Adhesives with Enhanced Thermal and Electrical Conductivity-Reference-Cited by-同舟云学术

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Double-Wall Nanotubes and Graphene Nanoplatelets for Hybrid Conductive Adhesives with Enhanced Thermal and Electrical Conductivity

Published:2016-08-29 Issue:35 Volume:8 Page:23244-23259
ISSN:1944-8244
Container-title:ACS Applied Materials & Interfaces
language:en
Short-container-title:ACS Appl. Mater. Interfaces

Author:

Messina Elena¹,Leone Nancy¹,Foti Antonino¹,Di Marco Gaetano¹,Riccucci Cristina²,Di Carlo Gabriella²,Di Maggio Francesco³,Cassata Antonio³,Gargano Leonardo³,D’Andrea Cristiano¹,Fazio Barbara¹,Maragò Onofrio Maria¹,Robba Benedetto³,Vasi Cirino¹,Ingo Gabriel Maria²,Gucciardi Pietro Giuseppe¹

Affiliation:

1. CNR−Istituto per i Processi Chimico-Fisici, Viale F. Stagno D’Alcontres 37, I-98168 Messina, Italy

2. CNR-ISMN, Area della Ricerca RM1-Montelibretti, Monterotondo Scalo, I-00016 Rome, Italy

3. Finmeccanica, Via Villagrazia 79, I-90125 Palermo, Italy

Funder

Ministero dell\'Istruzione, dell\'Università e della Ricerca

Publisher

American Chemical Society (ACS)

Subject

General Materials Science

Link

https://pubs.acs.org/doi/pdf/10.1021/acsami.6b06145

Reference70 articles.

1. Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: Materials, processing, reliability and applications

2. Performance and testing of thermal interface materials

3. Sepulveda, J. L.; Vandermark, L. J.InRF and Microwave Microelectronics Packaging,1st ed;Kuang, K.; Kim, F.; Cahill, S. S., Eds.Springer-Verlag:Berlin, 2010; Chapter 10, pp207–232.

4. See, for example, Epotek technologies (www.epotek.com) and DIEMAT/NAMICS products (www.diemat.com).

5. Development of Electrical Conduction in Silver-filled Epoxy Adhesives

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