Unraveling High Thermal Conductivity with In-Plane Anisotropy Observed in Suspended SiP<sub>2</sub>-Reference-Cited by-同舟云学术

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Unraveling High Thermal Conductivity with In-Plane Anisotropy Observed in Suspended SiP₂

Published:2024-03-06 Issue:11 Volume:16 Page:13980-13988
ISSN:1944-8244
Container-title:ACS Applied Materials & Interfaces
language:en
Short-container-title:ACS Appl. Mater. Interfaces

Author:

Dai Xueting¹^ORCID,Qiu Caiyu¹^ORCID,Bi Xiangyu¹^ORCID,Sui Chengqi¹,Chen Peng¹,Qin Feng¹^ORCID,Yuan Hongtao¹

Affiliation:

1. National Laboratory of Solid State Microstructures, College of Engineering and Applied Sciences, and Collaborative Innovation Center of Advanced Microstructures, Jiangsu Key Laboratory of Artificial Functional Materials, Nanjing University, Nanjing 210000, China

Funder

Natural Science Foundation of Jiangsu Province

National Natural Science Foundation of China

Publisher

American Chemical Society (ACS)

Link

https://pubs.acs.org/doi/pdf/10.1021/acsami.3c19091

Reference48 articles.

1. The future transistors

2. Promises and prospects of two-dimensional transistors

3. Transistors based on two-dimensional materials for future integrated circuits

4. Kelleher, A. B. Celebrating 75 years of the transistor A look at the evolution of Moore’s Law innovation; In 2022 International Electron Devices Meeting (IEDM), 2022, pp. 1.1.1–1.1.5

5. Thermal Transport in 2D Semiconductors—Considerations for Device Applications

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