Sub-10 nm Mixing and Alloying of Cu–Ag and Cu–Ni via Accelerated Solid Diffusion-Reference-Cited by-同舟云学术

Sub-10 nm Mixing and Alloying of Cu–Ag and Cu–Ni via Accelerated Solid Diffusion

Published:2023-05-30 Issue:23 Volume:15 Page:28398-28409
ISSN:1944-8244
Container-title:ACS Applied Materials & Interfaces
language:en
Short-container-title:ACS Appl. Mater. Interfaces

Author:

Dai Haiwen¹^ORCID,Dimitriadou Sofia²,Sankara Rama Krishnan P. S.¹,Handoko Albertus Denny³^ORCID,Recatala-Gomez Jose¹^ORCID,Wang Yong¹^ORCID,Repaka D. V. Maheswar³,Thway Maung¹,Zhang Chenguang¹^ORCID,Duchamp Martial¹^ORCID,Hippalgaonkar Kedar¹³^ORCID

Affiliation:

1. School of Materials Science and Engineering, Nanyang Technological University, Block N4.1, 50 Nanyang Avenue, Singapore 639798, Republic of Singapore

2. VSParticle B.V., Oostsingel 209, 2629 HL Delft, The Netherlands

3. Institute of Materials Research and Engineering, Agency for Science, Technology and Research (A*STAR), 2 Fusionopolis Way, Singapore 138634, Republic of Singapore

Funder

Agency for Science, Technology and Research

National Research Foundation Singapore

Publisher

American Chemical Society (ACS)

Subject

General Materials Science

Link

https://pubs.acs.org/doi/pdf/10.1021/acsami.3c04124

Reference56 articles.

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