Improving the Assembly Speed, Quality, and Tunability of Thin Conductive Multilayers
Author:
Affiliation:
1. Department of Chemical Engineering, Yale University, P.O. Box 208286, New Haven, Connecticut 06520-8286, United States
Publisher
American Chemical Society (ACS)
Subject
General Physics and Astronomy,General Engineering,General Materials Science
Link
https://pubs.acs.org/doi/pdf/10.1021/nn204384f
Reference46 articles.
1. Layer-by-layer assembly as a versatile bottom-up nanofabrication technique for exploratory research and realistic application
2. Fuzzy Nanoassemblies: Toward Layered Polymeric Multicomposites
3. Buildup of ultrathin multilayer films by a self-assembly process: III. Consecutively alternating adsorption of anionic and cationic polyelectrolytes on charged surfaces
4. Engineering materials layer-by-layer: Challenges and opportunities in multilayer assembly
5. Highly Ion Conductive Poly(ethylene oxide)-Based Solid Polymer Electrolytes from Hydrogen Bonding Layer-by-Layer Assembly
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