Two-Dimensional Materials Inserted at the Metal/Semiconductor Interface: Attractive Candidates for Semiconductor Device Contacts

Author:

Lee Min-Hyun1,Cho Yeonchoo1,Byun Kyung-Eun1,Shin Keun Wook1,Nam Seong-Geol1,Kim Changhyun1,Kim Haeryong1,Han Sang-A2,Kim Sang-Woo2ORCID,Shin Hyeon-Jin1ORCID,Park Seongjun1

Affiliation:

1. Samsung Advanced Institute of Technology, Suwon 443-803, Republic of Korea

2. School of Advanced Materials Science and Engineering, Sungkyunkwan University (SKKU), 2066 Seobu-ro, Jangan-gu, Suwon, Gyeonggi-do 440-746, Republic of Korea

Publisher

American Chemical Society (ACS)

Subject

Mechanical Engineering,Condensed Matter Physics,General Materials Science,General Chemistry,Bioengineering

Reference37 articles.

1. CMOS scaling into the nanometer regime

2. Intel Processors Overview. http://www.intel.com/content/www/us/en/products/processors.html (accessed April 19, 2017).

3. Samsung Semiconductor Global. http://www.samsung.com/semiconductor/about-us/news/ (accessed April 19, 2017).

4. 2015 International Technology roadmap for Semiconductors (ITRS). http://www.itrs2.net/ (accessed April 19, 2017).

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