Flow Boiling Enhancement Using Three-Dimensional Contact-Line Pinning on Hierarchical Superbiphilic Micro/Nanostructures-Reference-Cited by-同舟云学术

Flow Boiling Enhancement Using Three-Dimensional Contact-Line Pinning on Hierarchical Superbiphilic Micro/Nanostructures

Published:2022-10-19 Issue:21 Volume:22 Page:8487-8494
ISSN:1530-6984
Container-title:Nano Letters
language:en
Short-container-title:Nano Lett.

Author:

Salmean Christopher¹^ORCID,Qiu Huihe¹^ORCID

Affiliation:

1. Department of Mechanical and Aerospace Engineering, The Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong SAR China

Funder

Research Grants Council, University Grants Committee

International Science and Technology Project of Huangpu District of Guangzhou City

Publisher

American Chemical Society (ACS)

Subject

Mechanical Engineering,Condensed Matter Physics,General Materials Science,General Chemistry,Bioengineering

Link

https://pubs.acs.org/doi/pdf/10.1021/acs.nanolett.2c02915

Reference29 articles.

1. Critical heat flux maxima during boiling crisis on textured surfaces

2. Dynamic modeling with experimental validation and control of a two-phase closed thermosyphon as heat supplier of a novel pilot-scale falling film distillation unit

3. Analysis and feasibility of an evaporative cooling system with diffusion-based sessile droplet evaporation for cooling microprocessors

4. Socioeconomic impacts of heat transfer research

5. The boiling crisis phenomenon

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