Strong Negative Thermal Expansion along the O−Cu−O Linkage in CuScO2-Reference-Cited by-同舟云学术

Strong Negative Thermal Expansion along the O−Cu−O Linkage in CuScO2

Published:2002-04-19 Issue:6 Volume:14 Page:2602-2606
ISSN:0897-4756
Container-title:Chemistry of Materials
language:en
Short-container-title:Chem. Mater.

Author:

Li J.¹,Yokochi A.¹,Amos T. G.¹,Sleight A. W.¹

Affiliation:

1. Department of Chemistry, Oregon State University, Corvallis, Oregon 97331-4003, and NIST Center for Neutron Research, National Institute of Standards and Technology, 100 Bureau Drive, Stop 8562, Gaithersburg, Maryland 20899-8562

Publisher

American Chemical Society (ACS)

Subject

Materials Chemistry,General Chemical Engineering,General Chemistry

Link

https://pubs.acs.org/doi/pdf/10.1021/cm011633v

Reference36 articles.

1. p-Type conductivity in the delafossite structure

2. LaCuO25+x and YCuO2.5+x Delafossites: Materials with Triangular Cu2+δ Planes

3. Electrochemical and high pressure superoxygenation of YCuO2+x and LaCuO2+x delafossites

4. P-type electrical conduction in transparent thin films of CuAlO2

5. Transparent p-type conducting CuScO2+x films

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