High-Throughput Compatibility Screening of Materials for SF<sub>6</sub>-Alternative Insulation-Reference-Cited by-同舟云学术

High-Throughput Compatibility Screening of Materials for SF₆-Alternative Insulation

Published:2024-07-03 Issue: Volume: Page:
ISSN:0013-936X
Container-title:Environmental Science & Technology
language:en
Short-container-title:Environ. Sci. Technol.

Author:

Gao Wenqiang¹²,Posada Luisa F.³^ORCID,Shiravand Vahid¹²,Shubhashish Shubhashish³^ORCID,Price Capri⁴,Potyrailo Radislav A.⁵^ORCID,Younsi Karim⁵,Shan Shiyao⁵,Ndiaye Ibrahima⁵,Zhou Jierui¹²,Laso Andres⁶,Uzelac Nenad⁶,Zhong Wesley²,Suib Steven L.³^ORCID,Cao Yang¹²^ORCID

Affiliation:

1. Department of Electrical and Computer Engineering, University of Connecticut, Storrs, Connecticut 06269, United States

2. Electrical Insulation Research Center, Institute of Materials Science, University of Connecticut, Storrs, Connecticut 06269, United States

3. Department of Chemistry, University of Connecticut, Storrs, Connecticut 06269, United States

4. Institute of Materials Science, University of Connecticut, Storrs, Connecticut 06269, United States

5. GE Global Research Center, Niskayuna, New York 12309, United States

6. G&W Electric Company, 305 West Crossroads Pkwy, Bolingbrook, Illinois 60440, United States

Funder

Advanced Research Projects Agency - Energy

Publisher

American Chemical Society (ACS)

Link

https://pubs.acs.org/doi/pdf/10.1021/acs.est.4c03190

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