Controlling Interfacial Exchanges in Liquid Phase Bonding Enables Formation of Strong and Reliable Cu–Sn Soldering for High-Power and Temperature Applications-Reference-Cited by-同舟云学术

Controlling Interfacial Exchanges in Liquid Phase Bonding Enables Formation of Strong and Reliable Cu–Sn Soldering for High-Power and Temperature Applications

Published:2021-02-03 Issue:2 Volume:3 Page:921-928
ISSN:2637-6113
Container-title:ACS Applied Electronic Materials
language:en
Short-container-title:ACS Appl. Electron. Mater.

Author:

Silvain Jean-François¹²^ORCID,Constantin Loic²,Heintz Jean-Marc¹,Bordère Sylvie³,Teule-Gay Lionel¹,Lu Yong Feng²^ORCID,Diot Jean-Luc⁴,de Langlade Renaud⁴,Feuillet Emilien⁵

Affiliation:

1. CNRS, University of Bordeaux, Bordeaux INP, ICMCB, UPMR 5026, F-33608 Pessac, France

2. Department of Electrical and Computer Engineering, University of Nebraska—Lincoln, Lincoln, Nebraska 68588-0511, United States

3. CNRS, University of Bordeaux, Bordeaux INP, I2M, UPMR 5295, F-33608 Pessac, France

4. Composite Innovation, 2 allée du Doyen Brus, 33600 PESSAC, France

5. Innoptics, rue François Mitterrand, 33400 Talence, France

Publisher

American Chemical Society (ACS)

Subject

Materials Chemistry,Electrochemistry,Electronic, Optical and Magnetic Materials

Link

https://pubs.acs.org/doi/pdf/10.1021/acsaelm.0c01040

Reference21 articles.

1. Kassakian, J.; Perreault, D. In The Future of Electronics in Automobiles, Proceedings of the 13th International Symposium on Power Semiconductor Devices and ICs (ISPSD 01), 2001.

2. Madjour, K. Silicon Carbide Market Update: from Discrete Devices to Modules PCIM Europe 2014, Nuremberg.

3. A Review on Recent Advances in Transient Liquid Phase (TLP) Bonding for Thermoelectric Power Module

4. Interfacial reaction in Cu/Sn/Cu system during the transient liquid phase soldering process

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