Formation of polyimide/substrate interfaces: investigation of interfacial chemistry of polyamic acid with surfaces of silicon, copper, and chromium-Reference-Cited by-同舟云学术

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Formation of polyimide/substrate interfaces: investigation of interfacial chemistry of polyamic acid with surfaces of silicon, copper, and chromium

Published:1989-11-01 Issue:6 Volume:1 Page:592-596
ISSN:0897-4756
Container-title:Chemistry of Materials
language:en
Short-container-title:Chem. Mater.

Author:

Kowalczyk Steven P.,Jordan-Sweet Jean L.

Publisher

American Chemical Society (ACS)

Subject

Materials Chemistry,General Chemical Engineering,General Chemistry

Link

https://pubs.acs.org/doi/pdf/10.1021/cm00006a009

Cited by 27 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Preparation and properties of core–shell silver/polyimide nanocomposites;Polymer Bulletin;2014-07-15

2. Mutual Influence Between Adhesion and Molecular Conformation: Molecular Geometry is a Key Issue in Interphase Formation;The Journal of Adhesion;2013-02

3. Adhesion of a fluorinated poly(amic acid) with stainless steel surfaces;Applied Physics Letters;2013-01-21

4. Surface-Confined Synthesis of Silver Nanoparticle Composite Coating on Electrospun Polyimide Nanofibers;Small;2011-09-08

5. A study of the curing behavior of polyamic acid coated on a Cu or Zn layer;Colloids and Surfaces A: Physicochemical and Engineering Aspects;2008-07

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