SU-8-Induced Strong Bonding of Polymer Ligands to Flexible Substrates via in Situ Cross-Linked Reaction for Improved Surface Metallization and Fast Fabrication of High-Quality Flexible Circuits-Reference-Cited by-同舟云学术

SU-8-Induced Strong Bonding of Polymer Ligands to Flexible Substrates via in Situ Cross-Linked Reaction for Improved Surface Metallization and Fast Fabrication of High-Quality Flexible Circuits

Published:2016-02-09 Issue:7 Volume:8 Page:4280-4286
ISSN:1944-8244
Container-title:ACS Applied Materials & Interfaces
language:en
Short-container-title:ACS Appl. Mater. Interfaces

Author:

Hu Mingjun¹,Guo Qiuquan¹,Zhang Tengyuan¹,Zhou Shaolin²,Yang Jun¹

Affiliation:

1. Department of Mechanical and Materials Engineering, The University of Western Ontario, London, Ontario N6A 5B9, Canada

2. Department of Electronic and Information Engineering, South China University of Technology, Guangzhou 510641, P. R. China

Funder

Natural Sciences and Engineering Research Council of Canada

Publisher

American Chemical Society (ACS)

Subject

General Materials Science

Link

https://pubs.acs.org/doi/pdf/10.1021/acsami.5b10406

Reference28 articles.

1. The path to ubiquitous and low-cost organic electronic appliances on plastic

2. Epidermal Electronics

3. Inorganic Semiconductors for Flexible Electronics

4. Matrix-Assisted Catalytic Printing for the Fabrication of Multiscale, Flexible, Foldable, and Stretchable Metal Conductors

5. Selectively Metallized Polymeric Substrates by Microcontact Printing an Aluminum(III) Porphyrin Complex

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