Characterization and processing of polyimide thin films for microelectronics application-Reference-Cited by-同舟云学术

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Characterization and processing of polyimide thin films for microelectronics application

Published:1986-03 Issue:1 Volume:25 Page:38-40
ISSN:0196-4321
Container-title:Industrial & Engineering Chemistry Product Research and Development
language:en
Short-container-title:Ind. Eng. Chem. Prod. Res. Dev.

Author:

Lai Juey H.,Douglas Richard B.,Donohoe Kevin

Publisher

American Chemical Society (ACS)

Subject

General Engineering,General Medicine

Link

https://pubs.acs.org/doi/pdf/10.1021/i300021a010

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Reactive material jetting of polyimide insulators for complex circuit board design;Additive Manufacturing;2019-01

2. Poly(ether–imide)s with flexible linkages and kinks;High Performance Polymers;2016-07-28

3. Inkjet printing of polyimide insulators for the 3D printing of dielectric materials for microelectronic applications;Journal of Applied Polymer Science;2016-01-29

4. Preparation and enhanced properties of Fe3O4 nanoparticles reinforced polyimide nanocomposites;Superlattices and Microstructures;2015-09

5. Adhesion Behavior of PIQ to Si/SiO2 Surfaces;MRS Proceedings;1986

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