Ambient Drying Route to Aramid Nanofiber Aerogels with High Mechanical Properties for Low-<i>k</i> Dielectrics-Reference-Cited by-同舟云学术

Ambient Drying Route to Aramid Nanofiber Aerogels with High Mechanical Properties for Low-k Dielectrics

Published:2022-12-12 Issue:1 Volume:5 Page:866-876
ISSN:2637-6105
Container-title:ACS Applied Polymer Materials
language:en
Short-container-title:ACS Appl. Polym. Mater.

Author:

Liu Yiting¹,Robertson Mark²,Qiang Zhe²^ORCID,Meng Zheyi¹,Ye Changhuai¹^ORCID,Zhu Meifang¹^ORCID

Affiliation:

1. State Key Laboratory for Modification of Chemical Fibers and Polymer Materials, College of Materials Science and Engineering, Donghua University, Shanghai201620, China

2. School of Polymer Science and Engineering, The University of Southern Mississippi, Hattiesburg, Mississippi39406, United States

Funder

Science and Technology Commission of Shanghai Municipality

National Natural Science Foundation of China

Publisher

American Chemical Society (ACS)

Subject

Organic Chemistry,Polymers and Plastics,Process Chemistry and Technology

Link

https://pubs.acs.org/doi/pdf/10.1021/acsapm.2c01806

Reference60 articles.

1. Thermally conductive ultra-low-k dielectric layers based on two-dimensional covalent organic frameworks

2. Lightweight porous silica foams with extreme-low dielectric permittivity and loss for future 6G wireless communication technologies

3. A Facile Strategy for Non-fluorinated Intrinsic Low-k and Low-loss Dielectric Polymers: Valid Exploitation of Secondary Relaxation Behaviors

4. Ultralow dielectric constant polyarylene ether nitrile foam with excellent mechanical properties

5. Design of bi-modal pore structure polyarylene ether nitrile/SiO2 foams with ultralow-k dielectric and wave transparent properties by supercritical carbon dioxide

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