Flexible Copper–Graphene Nanoplates on Ceramic Supports for Radiofrequency Electronics with Electromagnetic Interference Shielding and Thermal Management Capacity

Author:

Jalouli Alireza1,Khuje Saurabh1,Sheng Aaron2ORCID,Islam Abdullah1,Di Luigi Massimigliano1,Petit Donald2,Li Zheng1ORCID,Zhuang Cheng-Gang3,Kester Lanrik3,Armstrong Jason1,Yu Jian4,Ren Shenqiang125ORCID

Affiliation:

1. Department of Mechanical and Aerospace Engineering, University at Buffalo, The State University of New York, Buffalo, New York 14260, United States

2. Department of Chemistry, University at Buffalo, The State University of New York, Buffalo, New York 14260, United States

3. Corning Research and Development Corporation, Corning, New York 14830, United States

4. Army Research Laboratory, Aberdeen Proving Ground, Aberdeen, Maryland 21005, United States

5. Research and Education in Energy Environment & Water Institute, University at Buffalo, The State University of New York, Buffalo, New York 14260, United States

Funder

Air Force Research Laboratory

Army Research Laboratory

Publisher

American Chemical Society (ACS)

Subject

General Materials Science

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