Grain Refinement via Changing the Shuffling Motion of the Grain Boundary by Traces of Ce and Lu in Gold Alloys-Reference-Cited by-同舟云学术

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Grain Refinement via Changing the Shuffling Motion of the Grain Boundary by Traces of Ce and Lu in Gold Alloys

Published:2022-12-18 Issue:51 Volume:126 Page:21864-21870
ISSN:1932-7447
Container-title:The Journal of Physical Chemistry C
language:en
Short-container-title:J. Phys. Chem. C

Author:

Liu Hao-Song¹,Xie Yao-Ping¹^ORCID,Zhou Wen-Yan²,Pei Hong-Ying²,Kang Fei-Fei²

Affiliation:

1. Institute of Materials, School of Materials Science and Engineering, Shanghai University, Shanghai200444, China

2. State Key Laboratory of Advanced Technologies for Comprehensive Utilization of Platinum Metals, Sino-platinum Metals Co., Ltd., No. 988, Keji Road, Kunming, Yunnan650106, China

Funder

International S and T Cooperation Program of Sichuan Province

Yunnan Province

Publisher

American Chemical Society (ACS)

Subject

Surfaces, Coatings and Films,Physical and Theoretical Chemistry,General Energy,Electronic, Optical and Magnetic Materials

Link

https://pubs.acs.org/doi/pdf/10.1021/acs.jpcc.2c07626

Reference52 articles.

1. Effects of calcium and palladium on mechanical properties and stored energy of hard-drawn gold bonding wire

2. The effects of Ca and Pd dopants on gold bonding wire and gold rod

3. What is the future of bonding wire? Will copper entirely replace gold?

4. Ultra-fine grain size and exceptionally high strength in dilute Mg–Ca alloys achieved by conventional one-step extrusion

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