Methyl Side-Group-Regulated Terphenyl Polyimides with High Heat Resistance and Ultralow Thermal Expansion for OLED Applications
Author:
Affiliation:
1. Shanghai Key Lab of Electrical & Thermal Aging, School of Chemistry and Chemical Engineering, Shanghai Jiao Tong University, Dongchuan Road No. 800, Shanghai 200240, China
Funder
National Natural Science Foundation of China
Publisher
American Chemical Society (ACS)
Link
https://pubs.acs.org/doi/pdf/10.1021/acsapm.4c00949
Reference42 articles.
1. Polyimide-Based High-Temperature Plastic Electronics
2. Recent Progress in Aromatic Polyimide Dielectrics for Organic Electronic Devices and Circuits
3. Substrates for flexible electronics: A practical investigation on the electrical, film flexibility, optical, temperature, and solvent resistance properties
4. High performance polyimides for applications in microelectronics and flat panel displays
5. Polyimide multilayer thin films prepared via spin coating from poly(amic acid) and poly(amic acid) ammonium salt
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