Characterization of Nanoscopic Cu/Diamond Interfaces Prepared by Surface-Activated Bonding: Implications for Thermal Management-Reference-Cited by-同舟云学术

Characterization of Nanoscopic Cu/Diamond Interfaces Prepared by Surface-Activated Bonding: Implications for Thermal Management

Published:2020-02-25 Issue:3 Volume:3 Page:2455-2462
ISSN:2574-0970
Container-title:ACS Applied Nano Materials
language:en
Short-container-title:ACS Appl. Nano Mater.

Author:

Liang Jianbo¹^ORCID,Ohno Yutaka²,Yamashita Yuichiro³,Shimizu Yasuo⁴^ORCID,Kanda Shinji¹,Kamiuchi Naoto⁵,Kim Seongwoo⁶,Koji Koyama⁶,Nagai Yasuyoshi⁴,Kasu Makoto⁷,Shigekawa Naoteru¹

Affiliation:

1. Department of Electronic Information Systems, Osaka City University, 3-3-138 Sumiyoshi, Osaka 558-8585, Japan

2. Institute for Materials Research (IMR), Tohoku University, 2-1-1 Katahira, Sendai 980-8577, Japan

3. National Metrology Institute of Japan, National Institute of Advanced Industrial Science and Technology, Tsukuba 305-8563, Ibaraki, Japan

4. Institute for Materials Research (IMR), Tohoku University, 2145-2 Narita, Oarai 311-1313, Ibaraki, Japan

5. The Institute of Scientific and Industrial Research (ISIR), Osaka University, 8-1 Mihogaoka, Osaka 567-0047, Japan

6. Adamant Namiki Precision Jewel Co., Ltd., Shinden 3-8-22 Adachi-ku, Tokyo 123-8511, Japan

7. Department of Electrical and Electronic Engineering, Saga University, 1 Honjo-machi, Saga 840-8502, Japan

Funder

New Energy and Industrial Technology Development Organization

Tohoku University

Publisher

American Chemical Society (ACS)

Subject

General Materials Science

Link

https://pubs.acs.org/doi/pdf/10.1021/acsanm.9b02558

Reference44 articles.

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4. Largely enhanced thermal conductivity of graphene/copper composites with highly aligned graphene network

5. Thermal properties of graphene/metal composites with aligned graphene

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