A nanoscale perspective on the effects of transverse microprestress on drying creep of nanoporous solids

Author:

Sinko Robert12ORCID,Bažant Zdeněk P.13ORCID,Keten Sinan13ORCID

Affiliation:

1. Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA

2. Department of Mechanical Engineering, Northern Illinois University, Dekalb, IL, USA

3. Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL, USA

Abstract

The Pickett effect describes the excess non-additive strain developed during drying of a nanoporous solid material under creep. One explanation for its origins, developed using micromechanical models, is the progressive relaxation of internally developed microprestress. However, these models have not explicitly considered the effects of this microprestress on nanoscale energy barriers that govern the relative motion and displacement between nanopore walls during deformation. Here, we evaluate the nanoscale effects of transverse microprestresses on the drying creep behaviour of a nanoscale slit pore using coarse-grained molecular dynamics. We find that the underlying energy barrier depends exponentially on the transverse microprestress, which is attributed to changes in the effective viscosity and degree of nanoconfinement of molecules in the water interlayer. Specifically, as the transverse microprestress is relaxed (i.e. its magnitude decreases), the activation energy barrier is reduced, thereby leading to an acceleration of the creep behaviour and a stronger Pickett effect. Based on our simulation results, we introduce a new microprestress-dependent energy term into our existing Arrhenius model, which describes the relative displacement of pore walls as a function of the underlying activation energy barriers. Our findings further verify the existing micromechanical theories for the origin of the Pickett effect and establish a quantitative relationship between the transverse microprestress and the intensity of the Pickett effect.

Funder

Army Research Office

Publisher

The Royal Society

Subject

General Physics and Astronomy,General Engineering,General Mathematics

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