Nanomechanical Analysis of Etched Si Surface for Adaptively Coupled Plasma Etching System for Sub-20 nm SADP Process Applications-Reference-Cited by-同舟云学术

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Nanomechanical Analysis of Etched Si Surface for Adaptively Coupled Plasma Etching System for Sub-20 nm SADP Process Applications

Published:2015-01-01 Issue:1 Volume:7 Page:133-138
ISSN:1947-2935
Container-title:Science of Advanced Materials
language:en
Short-container-title:sci adv mater

Author:

Kim Soo In,Kim Sung Joon,Park Myung Joon,Park Tae-Hee,Oh Sang-Ryong,Seo Sang-Il,Lee Sang-Woo,Kim Nam-Hun,Lee Chang Woo

Publisher

American Scientific Publishers

Subject

General Materials Science

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Structure and Mechanical Properties of (AlCrNbSiTiV)N Thin Films Deposited Using Reactive Direct Current Magnetron Sputtering;Science of Advanced Materials;2018-09-01

2. All-Inorganic Colloidal Perovskite Quantum Dots: A New Class of Lasing Materials with Favorable Characteristics;Advanced Materials;2015-10-08

3. Unraveling the ultralow threshold stimulated emission from CdZnS/ZnS quantum dot and enabling high-Q microlasers;Laser & Photonics Reviews;2015-08-19

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