Fabrication of Sn–58Bi–xCe Solder Paste Using Electrical Wire Explosion Method and its Mechanical Property-Reference-Cited by-同舟云学术

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Fabrication of Sn–58Bi–xCe Solder Paste Using Electrical Wire Explosion Method and its Mechanical Property

Published:2017-05-01 Issue:5 Volume:17 Page:3033-3037
ISSN:1533-4880
Container-title:Journal of Nanoscience and Nanotechnology
language:en
Short-container-title:j nanosci nanotechnol

Author:

Bang J. O¹,Lee H. S²,Jung S. B¹

Affiliation:

1. School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon, Gyeonggi-do 440-746, Republic of Korea

2. Advanced-Functional Material R&D Group, Korea Institute of Industrial Technology, 156 Gaetbeol-ro, Yeonsu-gu, Inchenon 406-840, Republic of Korea

Publisher

American Scientific Publishers

Subject

Condensed Matter Physics,General Materials Science,Biomedical Engineering,General Chemistry,Bioengineering

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Effect of in Addition on Thermodynamic Properties, Wettability, Interface Microstructure, and Soldering Performance of SnBiAg–xIn/Cu Solder Joints;Metals;2022-09-25

2. Reliability Assessment of Low-Power Processors in Supercomputing Systems;Nanoscience and Nanotechnology Letters;2017-08-01

3. Evaluation of the Long-Term Reliability of the Epoxy-Contained SAC305 Solder with Organic Solderability Preservative Surface Finish;Nanoscience and Nanotechnology Letters;2017-08-01

4. Effects of NiP Nodule Interfacial Morphology on Solder-Ball-Joint Reliability;Nanoscience and Nanotechnology Letters;2017-08-01

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