Numerical Analysis of Temperature and Thermal Stress Distribution for Whole Wafers in the Laser Annealing Process
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Published:2023-09-30
Issue:9
Volume:47
Page:449-460
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ISSN:1226-4881
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Container-title:Transactions of the Korean Society of Mechanical Engineers - B
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language:en
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Short-container-title:KSME-B
Author:
Jeong Seung-Won,Shin Joong-Han
Publisher
The Korean Society of Mechanical Engineers
Subject
Mechanical Engineering