Analysis of the Interfacial Reaction between Bulk Metallic Glass Coated Copper, Nickel, and Titanium with Lead-Free Solders
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Published:2021-04-30
Issue:1
Volume:25
Page:8
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ISSN:2356-4539
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Container-title:Makara Journal of Technology
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language:
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Short-container-title:MST
Author:
Laksono Andromeda Dwi,Yen Yee-wen,Tanjung Rifqi Aulia,Amatosa, Jr Teodoro A,Harwahyu Ruki
Publisher
Universitas Indonesia, Directorate of Research and Public Service
Subject
Computer Networks and Communications,Hardware and Architecture,Software
Cited by
1 articles.
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