Tensile bond strength of self-etching versus total-etching adhesive systems under different dentinal substrate conditions

Author:

Susin Alexandre Henrique1,Vasconcellos Walison Arthuso2,Saad José Roberto Cury3,Oliveira Junior Osmir Batista de3

Affiliation:

1. Santa Maria University

2. Montes Claros University

3. São Paulo State University

Abstract

The use of acid etchants to produce surface demineralization and collagen network exposure, allowing adhesive monomers interdiffusion and consequently the formation of a hybrid layer, has been considered the most efficient mechanism of dentin bonding. The aim of this study was to compare the tensile bond strength to dentin of three adhesive systems, two self-etching ones (Clearfil SE Bond - CSEB and One Up Bond F - OUBF) and one total-etching one (Single Bond - SB), under three dentinal substrate conditions (wet, dry and re-wet). Ninety human, freshly extracted third molars were sectioned at the occlusal surface to remove enamel and to form a flat dentin wall. The specimens were restored with composite resin (Filtek Z250) and submitted to tensile bond strength testing (TBS) in an MTS 810. The data were submitted to two-way ANOVA and Tukey's test (p = 0.05). Wet dentin presented the highest TBS values for SB and CSEB. Dry dentin and re-wet produced significantly lower TBS values when using SB. OUBF was not affected by the different conditions of the dentin substrate, producing similar TBS values regardless of the surface pretreatments.

Publisher

FapUNIFESP (SciELO)

Subject

Electrical and Electronic Engineering,Atomic and Molecular Physics, and Optics

Reference27 articles.

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