Ion Beam Self Annealing in Thin Silicon Films

Abstract

ABSTRACTResidual lattice disorder in lμm-thick silicon films as a function of the dose rate of 120 keV Ar+ ion implantations has been investigated. At a fluence of l×1 014 ions/cm2, low dose rates produced a highly damaged surface layer as expected; however, at a dose rate sufficient to locally heat the implanted film to a temperature of approximately 700°K, essentially complete annealing of the lattice disorder was observed. This temperature is significantly less than that normally required for post-implant thermal annealing. Measurements of lattice disorder were based on medium energy Rutherford backscattering and channeling analyses.