Author:
Grill A.,Meyerson B.,Patel V.
Abstract
The adhesion of diamondlike hard carbon films to silicide forming metals was improved by using an interfacial silicon film several atomic layers thick. The use of thicker (> 10nm) silicon layers results in a decrease in the adhesion, probably due to a degradation of the structural integrity by excessive silicide formation.
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Cited by
70 articles.
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