Metallization of High Thermal Conductivity Materials

Abstract

Great progress in LSI (large-scale integration) has been made over the past 10 years, and more rapid progress is expected in the future. In recent years, the increased circuit density in LSI devices has led to remarkable heat generation, thereby creating thermalmanagement issues for microelectronics packaging. In order to develop highperformance LSI effectively, packaging and system-level configuration of the computer must be modified to handle the heat.