Author:
Baumgart H.,Leamy H. J.,Trimble L. E.,Doherty C. J.,Celler G. K.
Abstract
ABSTRACTGrain boundary diffusion of arsenic and phosphorus in laser processed polycrystalline Si films has been investigated. Mesa diodes were fabricated in LPCVD Si thin films on SiO2 and subsequently recrystallized by cw Ar ion laser processing to form large grain material. The diffusion length of enhanced As and P diffusion along grain boundaries intersecting the p-n junction has been measured by the EBIC technique. Quantitative experimentation allowed determination of the grain boundary diffusion coefficients of As and P in the temperature range from 900°C to 1250°C.
Publisher
Springer Science and Business Media LLC
Cited by
2 articles.
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