Photoresist Stripping Using a Remote Plasma: Chemical and Transport Effects

Abstract

ABSTRACTPhotoresist removal from silicon substrates has been achieved by a dry processing method using a plasma remote from the substrate to produce active species. Although the principal gas used is oxygen, the addition of small amounts of other gases (N2O, HCI, HBr, H2, Cl2, CF4, and CHF3) has been shown to significantly enhance resist removal. The measured temperature dependences indicate that the effect of these additives may be a combination of oxygen atom production enhancement by neutral and ionic mechanisms as well as independent reaction with the resist.