Optimization of solid-phase epitaxial regrowth performed by UV nanosecond laser annealing
Author:
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Link
https://link.springer.com/content/pdf/10.1557/s43580-022-00443-8.pdf
Reference13 articles.
1. P. Batude et al., Opportunities and challenges brought by 3D-sequential integration. IEEE Int. Interconnect Technol. Conf. (IITC) 2021, 1–1 (2021). https://doi.org/10.1109/IITC51362.2021.9537356
2. P. Batude et al., 3DVLSI with CoolCube process: an alternative path to scaling. Sympos. VLSI Technol. (VLSI Technol.) 2015, T48–T49 (2015). https://doi.org/10.1109/VLSIT.2015.7223698
3. P. Batude et al., 3-D sequential integration: a key enabling technology for heterogeneous co-integration of new function with CMOS. IEEE J. Emerg. Sel. Top. Circuits Syst. 2(4), 714–722 (2012). https://doi.org/10.1109/JETCAS.2012.2223593
4. Fenouillet-Beranger, C. et al.: FDSOI bottom MOSFETs stability versus top transistor thermal budget featuring 3D monolithic integration. In: Proceedings of the 44th European Solid State Device Research Conference (ESSDERC), pp. 110–113, (2014). https://doi.org/10.1109/ESSDERC.2014.6948770
5. F.P. Luce et al., Methodology for thermal budget reduction of SPER down to 450°C for 3D sequential integration. Nucl. Instrum. Methods Phys. Res. Sect. B 370, 14–18 (2016). https://doi.org/10.1016/j.nimb.2015.12.021
Cited by 5 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Breakthrough Processes for Si CMOS Devices with BEOL Compatibility for 3D Sequential Integrated more than Moore Analog Applications;2024 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits);2024-06-16
2. Optimization of laser annealing parameters based on bayesian reinforcement learning;Journal of Intelligent Manufacturing;2024-04-15
3. Atomistic Insights into Ultrafast SiGe Nanoprocessing;The Journal of Physical Chemistry C;2023-09-27
4. EZ-FET junctions activation by nanosecond laser annealing;2023 21st International Workshop on Junction Technology (IWJT);2023-06-08
5. Low Temperature Junction Formation for EZ-FET;IEEE Journal of the Electron Devices Society;2023
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3