Adhesion Behavior of PIQ to Si/SiO2 Surfaces

Abstract

AbstractThe present paper reports the results of an investigation of the adhesion characteristics of PIQ13, an isoindaloquin-azolinedione-modified polyimide, to silicon wafers. The wafers were used both untreated and pretreated with a layer of CVD SiO2. Also investigated was the adhesion behavior of a condensation-type polyimide, P15878. A comparison is made between the behavior of the PIQ with two different coupling agents, an aluminum chelate (Coupler 3) and γ-aminopropyltriethoxy silane (A-1100). Superior adhesion performance of the A-1100 is indicated; and with A-1100, the adhesion of the two resins is similar.