Author:
Denton Denice D.,Pranjoto Hartono
Abstract
AbstractPolyimide is used extensively in a variety of integrated circuit packaging applications. It is a good dielectric material with excellent planarizing capabilities, but like most polymers, it absorbs moisture. This hygroscopic behavior can lead to reliability problems in integrated circuit packages. The effects of variations in process history on moisture uptake are examined using gravimetric measurement techniques. In particular, the effects of cure schedule and exposure to high temperature/high humidity environments on steady state moisture uptake are reported. Steady state moisture uptake is shown to be a decreasing function of cure temperature. Moreover, the steady state moisture uptake in polyimide is greater after the samples have been “aged” in a high temperature and humidity ambient. Electrical measurements are used to examine the effects of cure temperature on diffusion kinetics of moisture in polyimide. The diffusion coefficient decreases with increasing cure temperature.
Publisher
Springer Science and Business Media LLC
Cited by
9 articles.
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