Rapid and Non-Destructive Repair of Fused Silica with Cluster Damage by Magnetorheological Removing Method

Author:

Deng Mingjie,Song CiORCID,Shi Feng,Zhang Yaofei,Tian Ye,Zhang Wanli

Abstract

The damage repair of fused silica based on the CO2 laser repair technique has been successfully applied in high-power laser systems in the controllable nuclear fusion field. However, this kind of repairing technique mainly focuses on large-scale laser damage with sizes larger than 200 μm, but ignores the influence of cluster small-scale damage with sizes smaller than 50 μm. In order to inhibit the growth of small-scale damage and further improve the effect of fused silica damage repair, this paper carried out a study on the repair of fused silica damage using the magnetorheological (MR) removing method. The feasibility of fused silica damage repairing was verified, and the evolution law of the number, morphology, and the surface roughness of small-scale damage were all analyzed. The results showed that the MR removing method was non-destructive compared to traditional repairing technologies. It not only effectively improved the whole damage repairing rate to more than 90%, but it also restored the optical properties and surface roughness of the damaged components in the repairing process. Based on the study of the MR removing repair law, a combined repairing process of 4 μm MR removal and 700 nm computer controlled optical surfacing (CCOS) removal is proposed. A typical fused silica element was experimentally repaired to verify the process parameters. The repairing rate of small-scale damage was up to 90.4%, and the surface roughness was restored to the level before repairing. The experimental results validate the effectiveness and feasibility of the combined repairing process. This work provides an effective method for the small-scale damage repairing of fused silica components.

Funder

National Natural Science Foundation of China

National Key Research and Development Program of China

Strategic Priority Research Program of Chinese Academy of Sciences

Publisher

MDPI AG

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Control and Systems Engineering

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