Development of Shape Prediction Model of Microlens Fabricated via Diffuser-Assisted Photolithography

Author:

Kim Ha-Min1,Shin Yoo-Kyum2,Seo Min-Ho12

Affiliation:

1. School of Biomedical Convergence Engineering, Pusan National University, 49 Busandaehak-ro, Mulgeum-eup, Yangsan-si 50612, Republic of Korea

2. Department of Information Convergence Engineering, Pusan National University, 49 Busandaehak-ro, Mulgeum-eup, Yangsan-si 50612, Republic of Korea

Abstract

The fabrication of microlens arrays (MLAs) using diffuser-assisted photolithography (DPL) has garnered substantial recent interest owing to the exceptional capabilities of DPL in adjusting the size and shape, achieving high fill factors, enhancing productivity, and ensuring excellent reproducibility. The inherent unpredictability of light interactions within the diffuser poses challenges in accurately forecasting the final shape and dimensions of microlenses in the DPL process. Herein, we introduce a comprehensive theoretical model to forecast microlens shapes in response to varying exposure doses within a DPL framework. We establish a robust MLA fabrication method aligned with conventional DPL techniques to enable precise shape modulation. By calibrating the exposure doses meticulously, we generate diverse MLA configurations, each with a distinct shape and size. Subsequently, by utilizing the experimentally acquired data encompassing parameters such as height, radius of curvature, and angles, we develop highly precise theoretical prediction models, achieving R-squared values exceeding 95%. The subsequent validation of our model encompasses the accurate prediction of microlens shapes under specific exposure doses. The verification results exhibit average error rates of approximately 2.328%, 7.45%, and 3.16% for the height, radius of curvature, and contact angle models, respectively, all of which were well below the 10% threshold.

Funder

National Research Foundation of Korea through the Korean government

Ministry of Health and Welfare

Publisher

MDPI AG

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Control and Systems Engineering

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