Use of Sn60Pb40 Solder in Resistance Element Soldering Technology

Abstract

This work presents a new technology for joining dissimilar materials, Resistance Element Soldering (RES). This technology is fundamentally based on Resistance Element Welding (REW) technology; the difference is that the presented RES uses a bimetallic element composed of a hard Cu shell and a core made of Sn60Pb40 solder. The RES technology using the Cu/Sn60Pb40 bimetallic element was tested when joining a galvanized steel sheet (HX220BD-100MBO) to a thermoplastic (PMMA). The effect of the process parameters on the volume of the melted solder, the deformation of the element, and the structure of the soldered joint was investigated on the joints made. The final criterion for assessing the influence of the process parameters was the joint strength. Due to the low strength of PPMA, the maximum joint strength was determined on RES joints of galvanized steel sheet and aluminum. The results showed that, to ensure the joint strength at the level of the strength of the Sn60Pb40 solder used, a heat input of 952 J and a clamping force of 623 N are required. The mentioned parameters ensure the necessary conditions for the creation of a soldered joint with a galvanized steel sheet as well as the deformation of the bimetallic element to create a form-fit effect in the opening of the PMMA to create a mechanical connection.