Experimental Study on Dynamic Compression Mechanical Properties of Aluminum Honeycomb Structures

Author:

Zhang Sheng,Chen WeiORCID,Gao Deping,Xiao Liping,Han Longbao

Abstract

In this paper, dynamic compression tests are developed to investigate the dynamic compression mechanical properties of the aluminum honeycomb structures at different strain rates, especially at the high strain rates. The difficulties at the high strain rates exist due to the large deformation, the low wave resistance and the size effect of the honeycomb structures. The Split Hopkinson Pressure Bar (SPHB) test method is carried out and special measures such as the adoption of waveform shaper, the size optimization of the impact bar and the specimen, and employment of the semiconductor strain gauge, etc. are taken to overcome the difficulties. It is discovered that the dynamic compression mechanical properties possess a stress hardening effect at a high strain rate from 1.3 × 103 s−1 to 2.0 × 103 s−1, but then a stress softening effect at a high strain rate of 4.6 × 103 s−1. It is also discovered that the yield strength and the average plateau stress at the strain rate of 2.0 × 103 s−1 is higher than that at the strain rate of 1.3 × 103 s−1. However, the yield strength and the average plateau stress at the strain rate of 4.6 × 103 s−1 is lower than that at the strain rate of 2.0 × 103 s−1 and 1.3 × 103 s−1, but higher than that at a quasi-static state. This indicates that the aluminum honeycomb structure is sensitive to the strain rate. Additionally, the damage mode of the aluminum honeycomb structure is plastic buckling, collapse and folding of the cell wall, which is carried out using dynamic compression tests. The folding length of the cell wall at a higher strain rate is found to be longer than that at a lower strain rate. The test results can also be used as the stress–strain curves of the honeycomb constitutive model at the high strain rates to carry out the numerical simulation of high-speed impact.

Funder

Fundamental Research Funds for the Central Universities

Publisher

MDPI AG

Subject

Fluid Flow and Transfer Processes,Computer Science Applications,Process Chemistry and Technology,General Engineering,Instrumentation,General Materials Science

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