Solder Joint Defect Detection in the Connectors Using Improved Faster-RCNN Algorithm

Author:

Zhang Kaihua,Shen Haikuo

Abstract

The miniaturization and high integration of electronic products have higher and higher requirements for welding of internal components of electronic products. A welding quality detection method has always been one of the important research contents in the industry, among which, the research on solder joint defect detection of a connector has gradually attracted people’s attention with the development of image detection algorithm. The traditional solder joint detection method of connector adopts manual detection or automatic detection methods, which is inefficient and not safe enough. With the development of deep learning, the application of a deep convolutional neural network to target detection has become a research hotspot. In this paper, a data set of connector solder joint samples was made and the number of image samples was expanded to more than 3 times of the original by using data augmentation. Clustering generates anchor boxes and transfer learning with ResNet-101 were fused, so an improved faster region-based convolutional neural networks (Faster RCNN) algorithm was proposed. The experiment verified that the improved algorithm proposed in this paper had a great improvement in all aspects compared with the original algorithm. The average detection accuracy of this method can reach 94%, and the detection rate of some defects can even reach 100%, which can completely meet the industrial requirements.

Publisher

MDPI AG

Subject

Fluid Flow and Transfer Processes,Computer Science Applications,Process Chemistry and Technology,General Engineering,Instrumentation,General Materials Science

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