Performance Properties and Finite Element Modelling of Forest-Based Bionanomaterials/Activated Carbon Composite Film for Sustainable Future

Abstract

Thanks to its highly crystalline structure and excellent thermal, optical, electrical and mechanical properties, carbon and its derivatives are considered the preferred reinforcement material in composites used in many industrial applications, especially in the forest and forest products sector, including oil, gas and aviation. Since hydroxyethyl cellulose (HEC) is a biopolymer, it has poor mechanical and thermal properties. These properties need to be strengthened with various additives. This study aims to improve the thermal and mechanical properties of hydroxyethyl cellulose by preparing hydroxyethyl cellulose/activated carbon (HEC/AC) composite materials. With this study, composites were obtained for the first time and their mechanical properties were examined using a 3D numerical modeling technique. The thermal stability of the prepared composite materials was investigated via thermal gravimetric analysis (TGA). The samples were heated from 30 °C to 750 °C with a heating rate of 10 °C/min under a nitrogen atmosphere and their masses were measured subsequently. The mechanical properties of the composites were investigated via the tensile test. The viscoelastic properties of the composite films were determined with dynamic mechanical thermal analyses (DMTA) and their morphologies were examined with scanning electron microscopy (SEM) images. According to the results, the best F3 sample (films containing 3 wt.% activated carbon) had an elastic modulus of 168.3 MPa, a thermal conductivity value of 0.068 W/mK, the maximum mass loss was at 328.20 °C and the initial storage modulus at 30 °C was 206.13 MPa. It was determined that the hydroxyethyl cellulose composite films containing 3 wt.% activated carbon revealed the optimum results in terms of both thermal conductivity and viscoelastic response and showed that the obtained composite films could be used in industrial applications where thermal conductivity was required.