Numerical Simulation on Thermoelectric Cooling of Core Power Devices in Air Conditioning

Author:

Wang Jiang1ORCID,Hu Kai1,Tang Kechen1,Xing Yubing1,Xiao Yani1,Liu Yutian1,Yan Yonggao1,Yang Dongwang1

Affiliation:

1. State Key Laboratory of Advanced Technology for Materials Synthesis and Processing, Wuhan University of Technology, Wuhan 430070, China

Abstract

Air conditioning has become a necessity in people’s daily life. The performance of the compressor determines the energy efficiency ratio of this electrical equipment, but the heat generated during the operation of its internal core power components will greatly limit its performance release, so it is urgent to carry out research on the heat dissipation of power devices. In this work, we explore the application of thermoelectric coolers (TECs) in the field of power device heat dissipation through finite element simulation. First, we geometrically modeled the structure and typical operating conditions of core power devices in air conditioners. We compared the temperature fields in air-cooling and TEC active cooling modes for high-power-consumption power devices in a 319 K operating environment. The simulation results show that in the single air-cooling mode, the maximum temperature of the 173.8 W power device reached 394.4 K, and the average temperature reached 373.9 K, which exceeds its rated operating temperature of 368.1 K. However, the maximum and average temperature of the power device dropped to 331.8 K and 326.5 K, respectively, at an operating current of 7.5 A after adding TECs, which indicates that TEC active cooling has a significant effect on the temperature control of the power device. Furthermore, we studied the effect of the TEC working current on the temperature control effect of power devices to better understand the reliability of the TECs. The results show that TECs have a minimum working current of 5 A, which means it has no significant cooling effect when the working current is less than 5 A, and when increasing the current to 10 A, the average temperature of the power device can be reduced to 292.9 K. This study provides a meaningful exploration of the application of TECs in chip temperature control and heat dissipation, providing a new solution for chip thermal management and accurate temperature control.

Funder

National Natural Science Foundation of China

International Postdoctoral Exchange Fellowship Program

National Key Research and Development Program of Chin

Publisher

MDPI AG

Subject

Fluid Flow and Transfer Processes,Computer Science Applications,Process Chemistry and Technology,General Engineering,Instrumentation,General Materials Science

Reference55 articles.

1. Puttaswamy, K., and Loh, G.H. (May, January 30). Thermal Analysis of a 3D Die-Stacked High-Performance Microprocessor. Proceedings of the 16th ACM Great Lakes Symposium on VLSI, Philadelphia, PA, USA.

2. Comprehensive Parametric Study of Using Carbon Foam Structures Saturated with PCMs in Thermal Management of Electronic Systems;Nada;Energy Convers. Manag.,2015

3. A Review on Transient Thermal Management of Electronic Devices;Mathew;J. Electron. Packag.,2022

4. Brooks, D., and Martonosi, M. (2001, January 19–24). Dynamic Thermal Management for High-Performance Microprocessors. Proceedings of the HPCA Seventh International Symposium on High-Performance Computer Architecture, Monterrey, Mexico.

5. The Relationship among CPU Utilization, Temperature, and Thermal Power for Waste Heat Utilization;Haywood;Energy Convers. Manag.,2015

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3